سال انتشار: ۱۳۸۶

محل انتشار: دومین کنفرانس نانوساختارها

تعداد صفحات: ۲

نویسنده(ها):

M.R Toroghinejad – Materials Engineering Department,Isfahan University of Technology
M Shaarbaf – Materials Engineering Department,Isfahan University of Technology

چکیده:

Accumulative roll bonding (ARB) process is a severe plastic deformation (SPD) process that has been used for pure copper. The ARB process up to 8 cycles was performed at ambient temperature. Microstructural characterizations were done by TEM and EBSD. It was found that grain subdivision and continuous recrystallization resulted in microstructure covered with recrystallized nano grains with an average diameter below 100nm