سال انتشار: ۱۳۸۵

محل انتشار: اولین همایش ملی دانشجویی مهندسی HSE و سومین همایش ملی دانشجویی مهندسی بازرسی فنی

تعداد صفحات: ۷

نویسنده(ها):

Masoud Nematollahi – Chemical engineer (Ghaed Baslr Petrochemical Company (GBPC))
mehrdad Nematollahi – Safety & Technical Inspection Student ( P.U.T)

چکیده:

Industrial radiography began in the early 1920s and came of age during World War II due to better quality inspection requirements for high performance fighter planes. Film-less radiography in theform of fluoroscopy was successfully tried for the first time to inspect the aircraft’s parts. The futureof the non-destructive testing industry looks bright in view of the emphasis on achieving reliability in materials and processes for the space, medical and military industries in particular. Structurecomplexity combined with high integration level in microelectronic industry is making. the analysismore and more difficult. Non Destructive Analysis of either new semiconductor generation (e.g BGA, Flipchip) or double-sided printed Is becoming very difficult as most of the critical structurefeatures are, circuit boards hidden. Although 2l}.X-rays inspection is still the most popular non-destructive inspection technique weneed advance inspection tools to improve our analysis capability. Micro 3-D tomography system, combining high-resolution microfocus X-rays technology with state of the art computer aided 31).. reconstruction possibilities provides an answer to technicians. After few minutes’ data acquisition, thesystems enables you to access to structure details, by using fast specimen non destructive slicing(layers analysis), and tomosynthesis 3D-reconstruction images. Several examples extracted from test analysis show the advantage offered by this new tomography technique to microelectronic community